BERGEN OP ZOOM, THE NETHERLANDS, September 2, 2021 - Cicor Group, a leading manufacturer of printed circuit boards and hybrid circuits, has selected SABIC’s LNP™ THERMOCOMP™ compounds with laser direct structuring (LDS) capability to produce high-end, three-dimensional molded interconnect devices (3D-MIDs). Building on a longstanding relationship, Cicor and SABIC successfully collaborated to meet multiple, stringent requirements for sophisticated devices used in 5G networking, automotive and consumer electronics applications. SABIC’s portfolio of LNP THERMOCOMP compounds delivers excellent flow for thin walls used in miniaturized designs, optimized LDS performance to achieve uniform fine-pitch circuit patterns and high heat resistance for use in the surface mount technology (SMT) assembly process.

“SABIC is a pioneer in materials that enable laser direct structuring, which is critical for producing highly integrated electronics that save precious space in smaller and thinner electronic devices,” said Joshua Chiaw, Director, Business Management, LNP & NORYL, Specialties, SABIC. “As 3D-MID technology rapidly advanced and Cicor looked to innovate the design of its products to gain higher performance and precision, SABIC was able to meet the company’s needs. We’re committed to leveraging our materials innovation and expertise to help customers like Cicor stay at the forefront of electronics megatrends.”

“As we explored the use of liquid crystal polymers for our fine-pitch 3D-MID products, we quickly found that SABIC’s LNP THERMOCOMP compounds, which are based on LCPs, far surpassed competitive offerings in the uniformity and precision of circuit traces, and were clearly the solution that could best fit our needs,” said HS Song, Managing Director, China, Suzhou Cicor Technology Co., Ltd. “These materials also help us optimize yield rates to drive down total system costs. To further support our successful use of LNP THERMOCOMP compounds, SABIC provided many value-added services, including formulation adjustments. SABIC exemplifies supplier excellence through deep materials expertise, unmatched technical capabilities and rapid response.”

Innovative Material Technology for MIDs
Molded interconnect devices integrate electronic and mechanical functions in a single, three-dimensional package to save space and weight compared to traditional printed circuit boards (PCBs). These high-precision, miniaturized devices help address rigorous demands for higher performance in smaller form factors that are arising from the implementation of 5G infrastructure and 5G-enabled applications. For instance, 5G networking in cities requires many small cell towers, placed close together, to deliver faster data transmission—while remaining unobtrusive.

SABIC’s LDS-enabled LNP THERMOCOMP materials can play an important role in designing and manufacturing high-end MIDs. The performance enables manufacturers to create fine-pitch devices, which are distinguished by very narrow spacing (